牌號 | BCC Resins HPX-850 |
廠家 | BCC Products Inc. |
分類 | 環(huán)氧 |
介紹 | HPX-850 is a light weight, heat resistant, two component epoxy backfill system. Like BC 7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. It is ideally suited for numerous applications involving mold and core constructions. HPX-850 can be removed from the mold after allowing to set 24 hours @ room temperature (75°F). Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. |
BCC Products Inc. 產(chǎn)品展示 | 種類 |
---|---|
BCC Resins BC 7069-2 | 環(huán)氧 |
BCC Resins BC 5200 | 環(huán)氧 |
BCC Resins BC 5114 | 環(huán)氧 |
BCC Resins BC 6005 | 環(huán)氧 |
BCC Resins BC 5009 | 環(huán)氧 |
BCC Resins BC 6060 | 環(huán)氧 |
BCC Resins BC 5003 | 環(huán)氧 |
BCC Resins BC 6126 | 環(huán)氧 |
BCC Resins BC 7062H | 環(huán)氧 |
BCC Resins BC 7062-2H | 環(huán)氧 |
訂購說明